ESSEMTEC :: Pick and Place :: Highly flexible systems for small/mid size volumes :: FLX2010-CVD :: SMD-Pick and Place Automat and Die Bonder

ESSEMTEC AG
Mosenstrasse 20
CH-6287 Aesch
Switzerland

Phone +41 41 919 60 60
Fax +41 41 919 60 50
Mail info@essemtec.com

Adress of your local ESSEMTEC Partner

HLX Series
High mix / high speed SMD pick and place, up to 22'000 cph

FLX Series
Super flexible SMT pick and place, 5'000 to 15'000 cph

CSM Series
Automatic SMT pick and place system for smaller volumes, up to 4'000 cph

EXPERT and MPL Series
Semiautomatic and manual SMT pick and place systems for small volumes and prototypes

Technology information

In line convection reflow oven for midsize volumes: RO400FC-C

Stand alone convection reflow oven for midsize volumes: RO400FC

Convection reflow oven for series and prototypes: RO300FC

Batch convection reflow oven for prototypes and small volumes: RO06-PLUS

Software for graphing temperature profiles: ROSOFT

Software for process simulation and oven steering: RO-CONTROL

Wave Solder machine for leadfree applications: WS330

Overview Dispensing applications in various industries

NanoJet valve dispensing systems Contactless dispensing
CDS6250

In line dispensing systems for a large variety of applications:
CDS6900-C/CDS6700-C

Stand alone dispensing systems for a wide range of low volume applications: CDS6900

Table top/Stand alone dispensing systems for small batches: CDS6700

Dispensing system with automated workpiece loader/unloader: CDS-Autoload

Integrated dispensing systems in automatic pick and place machines (midsize): FLX-DTP/DSV

Integrated dispensing systems in automatic pick and place machines (low volume): CSM701/704

Integrated dispensing systems in automatic pick and place machines: EXP501

Fully automatic inline printer (29") for medium to high end productions: SP900

Batch printer (29") with automatic vision centering: SP600

Programmable printer with automatic vision alignment: SP200-AV

Semiautomatic printers for low/midsize volumes: SP003

Squeegee guided printers for high precision in low volumes: SP002-R

Manual printers for low volumes and prototypes: SP002

Overview Management Information System MIS

Bar code based feeder loading for fast and secure feeder changes: MIS-BAR

Software based efficient component managemente: MIS-DATA

Optimisation Software for FLX Pick and Place systems: MIS-FLX

Production planning software with optimisation tools: MIS-PROD

Traceability software for full process history: MIS-TRACE

Board loaders for automation of your process: BHL02

Board unloaders for automation of your process: BHU02

Combined Loading / Unloading Stations for automation of your process: BH06

Combined Loading/Unloading/Buffer Station for automation of your process: BH08

Automatic SMD storage system: Access time of 8 to 12 seconds for every component CSS4050

Modular inline systems MEGAFLEX-Line

Modular inline systems for midsize volumes: SUPERFLEX-Line

Modular inline systems for midsize volumes: Hyflex-Line

Stand alone automatic production lines for midsize volumes: Hyflex

Stand alone automatic production lines for low volumes: Flex

Semiautomatic production lines for low volumes: Midi-Flex

Manual production/prototyping lines for low volumes: Mini-Flex

Technology informations

LED placement with adhesive and conductive paste dispensing: LED-PLACE

Selective placement line for resistor balancing: SEL-PLACE

Dispensing system with automated workpiece loader/unloader: CDS-Autoload


		Produkte \| Bestücker

Pick&Place and Die Bonder for COB applications. Integrated glue and paste dispenser.


	Placement of Si-chips and SMD components

	Ideal for COB applications or Die Bonding on lead frames

	Integrated dispense system for glue or paste

	Feeding systems for tray stacks (4x4" trays)

	Reel, stick and tray feeder systems for SMD components

	Adjustable inline transport system for different substrate width

	Automatic recognition of reference marks on the substrate

	Easy and quick programming, coordinate files can be imported

	Optical control and alignment systems, universal for all component sizes

	Fast and precise placement

Placement rate 6.000 cph. Component size 0201 (0.5x0.25 mm) to 33x33 mm. Substrate size variable 50x50 mm to 400x200 mm. Repeatability <20 um. Up to 8 tray stacks (20 trays each, 4x4"). Additionally up to 40 standard tapes for SMD components.

				Please click on one of the pictures to see more detailed Features.

Fully Automatic
HLX8100/8200
FLX2021/2031-V
FLX2011-V
FLX2011-C
FLX2011
FLX2011-MK
CSM7100

Manual/Semi-Automatic
EXPERT-SA/SAFP
EXPERT-M/FP

Selective Placement
MPL/UP3100