RO-CONTROL combines all important functions for the process evaluation and process control for reflow ovens.
Reflow oven control via PC
Reflow profile simulation
Comparison with solder paste reference
Solder paste data base
Profile library for different PCB
Measure, save and compare temperature profiles (RO-CONTROL includes RO-SOFT)
Save process changeover to lead free process
The software enables the simulation of soldering profiles at different settings and the comparison with a solder paste library. The number of profiles managed with RO-CONTROL is unlimited. The software also controls and supervises the reflow oven and ensures a save operation. RO-CONTROL runs on all reflow ovens of the RO300FC and RO400FC Series.