SP600 batch printer (29") with automatic vision centering

18.08.2007

The SP600 is unique. It combines the positive attributes of a batch printing system (easy loading/unloading, printing on any kind of material) with the advantages of a fully automatic printer (automatic offset correction, process independent of the user).

Due to the very robust construction and the implementation of highly accurate rail systems, the SP600 is ready to solve even the most precise printing task.

The SP600 is designed for the use in a medium volume production or as a standalone printer for specialties or to cover peak loads. more information...

F&S Market Leadership Award 2006 Presented to ESSEMTEC AG

28.08.2006

ESSEMTEC AG, a leading manufacturer of surface mount technology production equipment, announces that it has been awarded by Frost&Sullivan for Market Leadership in the SMT Benchtop Equipment market spanning screen printer, pick and place equipment as well as reflow soldering systems. ESSEMTEC wins the award for their complete product range, customer orientation and their high name recognition all over the world.

As one of the only suppliers in the world, ESSEMTEC offers a complete production line from one source including screen/stencil printer, dispenser, pick&place and reflow soldering equipment. Fully automatic inline solutions are available as well as small manual systems for prototyping. All machines feature maximum flexibility for quick changeover in a high mix production. ESSEMTEC completes its' product range by production optimisation and management software (M.I.S.) which proves an effective tool for improving productivity and maximizing efficiency.

All products are continuously improved based on feedback of the customers and technological evolution. Therefore, the machines and systems are always in sync with the actual market requirements. The possibility for upgrades and the protection of the customer's investment are always in focus of development.

Since 1991 ESSEMTEC AG in Switzerland develops, produces and di.stributes flexible SMT assembly equipment all over the world. It provides world class products and exceptional services and is today recognized as number one player in the SMT benchtop industry. Frost & Sullivan is proud to acknowledge ESSEMTEC for the 2006 Market Leadership Award in the SMT Benchtop equipment market.

ESSEMTEC to Highlight the new HLX8200 Pick&Place at Globaltronics 06

24.08.2006

ESSEMTEC AG, a leading manufacturer of surface mount technology production equipment, announces that it will display the new HLX8200 pick and place on booth #D31 at the upcoming GLOBALTRONICS exhibition, scheduled to take place from October 10 to 13 in Singapore.

HLX8100/8200 are new SMD pick+place machines from ESSEMTEC. They feature a high production speed (up to 22’000 cph) and a large feeder capacity (192 tape and stick feeders). Additionally, 16 Jedec trays can be used without loss of any feeder space. Intelligent feeders are standard and changeover is possible during operation. The machines can be  programmed and set up easily by means of a comfortable software.

The outstanding component range covers 01005 chips up to large area components of 50x50 mm with a height of 17 mm. The application range also includes BGA, Micro-BGA and flip chip components. All parts are measured and aligned by Cognex SMD 4 vision (standard feature). A speciality of the HLX is the back light illumination of the components which avoids reflections and offers best accuracy and speed.

The running smoothness even at highest speed is surprising. The linear motors used in both axes work quietly and allow very high acceleration and precision. Furthermore, the robust machine design guarantees best reliability, long lifetime and continuous quality in multiple shift operation. The robots can calibrate themselves automatically by use of reference marks on all mechanical parts (feeder racks, nozzle holder, etc.).

Another highlight of the HLX pick+place is the Remote Support . This internet based system enables quick help by a product specialist without travel expenses or loss of time. A free license of the Remote Support software is delivered with every new machine.

The SMD pick+place machines of the HLX series show their advantages best in a high mix production environment. They convince with their flexibility and reliability and the extraordinary price/performance ratio.

New: CSM7100-V with vision

16.11.2005

The CSM7100-V entry-level placement machine is now available with vision capability and intelligent feeders. It will leave no wish unfulfilled. Every component to be placed in today's small-lot manufacturing processing SMD parts, can and will be placed by it. Placement performance: up to 4,000 cph. The CSM7100-V will be first shown at PRODUCTRONICA in Munich.

Wave solder machine, now also with Woerthmann wave

14.11.2005

A significant improvement in wetting properties. Up to 90% less solder bridging with SOIC, up to 70% less dross forming. All this is achieved through the patented Woerthmann wave procedure. The system replaces the up to now required chip- and lambda waves and it is of advantage not just when working with lead-free solders.

In-line printer with trans-stencil vision system

10.11.2005

Lead-free solder pastes demand even more accurate paste printing to guarantee the required solder quality. Therefore, the new SP200AVC in-line stencil printer aligns the printed circuit board automatically - by looking through the stencil openings directly at the pads to be printed on. After centring, the board is directly printed without any further processing. There is no process more accurate!

Less than 1,000 ppm

9.11.2005

The new wave soldering machines WS330 are designed for lead free applications. A special composite coating of all wave elements allow to set the machine to higher temperature ranges. A highly efficient convection preheating zone allows to build the machine in a compact format compared to IR preheating based machines. The integrated dual wave and an automatic spray fluxing system allow to use the machine for THT and SMD components.

Software Upgrade for CSM7000-PLUS

25.09.2005

The new software release LIGHTPLACER 7.0 offers many of the advantages of the CSM7100 which now available also for the CSM7000-PLUS users!

Process Simulation And Control For Reflow Ovens

12.09.2005

RO-CONTROL combines all important functions for the process evaluation and process control for reflow ovens. The software enables the simulation of soldering profiles at different settings and the comparison with a solder paste library.

Low Cost Pick and Place with Intelligent Feeders

26.08.2005

The new SMD pick and place CSM7100 from ESSEMTEC ideally fulfils the requirements of a high mix / low volume production. The low cost pick and place system offers a great performance and places a large variety of components – from 0402 up to 33x33 mm QFP. The narrow built feeders are intelligent and programmable what reduces changeover time and avoids setup errors.

New Wave Solder machine for lead free applications

29.06.2005

The new wave soldering machines WS330 are designed for lead free applications. A special composite coating of all wave elements allow to set the machine to higher temperature ranges. A highly efficent convection preheating zone allows to build the machine in a compact format compared to IR preheating based machines. The integrated dual wave and an automatic spray fluxing system allow to use the machine for THT and SMD components.