Monday, July 21, 2008

RO400FC Named as Finalist for 2008 Advanced Packaging Award

Press release of July 21, 2008:

Glassboro, NJ — Essemtec, a leading manufacturer of surface mount technology production equipment, announces that its RO400FC, a full convection reflow oven for small to mid-size volume productions with RO-CONTROL software, was named First Finalist in the category of Reflow Equipment during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

Soldering complex SMD boards and new package technologies requires a well-controlled soldering process. RO400FC uses only full convection to heat PCBs homogeneously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the oven perfect for lead-free solders.

Zone temperatures are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.

As an innovative new feature, RO400FC now features RO-CONTROL software for increased process simulation and control. RO-CONTROL combines all the important functions for the process evaluation and process control for reflow ovens. This technologically advanced software offers many of the same features as thermal profilers, but for less than half the price. Also, because the software is within the RO400FC, ESSEMTEC is able to offer users an industry first.

The universal mesh belt or the optional precise chain conveyor transports single- or double-sided boards up to 400 mm width. Other benefits include a full convection oven for even temperature distribution, high air volume for low thermal stress of components, vertical laminar flow for efficient heat transfer, closed-loop conveyor drive system for controlled speed, easy profile selection and an optional flying thermocouple for temperature profiling. RO400FC with RO-CONTROL software is for standard or lead-free soldering, features an integrated microprocessor control or computer control option, an optional SMEMA interface, ESSEMTEC RO-SOFT profiling software, and built-in security switches.

RO400FC is equipped with special hot air convection modules. Each module contains a high-volume blower and unique airflow construction for ideal heat transfer. An additional double fan cooling zone at the exit cools down the PCBs quickly. The convection technology applies the same temperature everywhere on the board, independent of component size or color, making programming as easy as possible.

To provide the best possible heat transfer and to run the oven with a stable profile, a physically ideal airflow is used. The vertical air stream provides an efficient heat transfer. The ability to work with lower gas temperatures leads to lower thermal stress to components. Even small components will not be shifted during the reflow procedure while enough heating power is provided for difficult boards. A unique hole pattern in each chamber ensures perfect overall heat distribution. This allows soldering of difficult boards with lead-free paste.

The integrated microprocessor control with LCD display provides an easy-to-use operator interface and storage capacity up to 28 profiles or a new computer control option includes built in ROSOFT profiling software with unlimited profile storage. Each heating zone is continuously monitored and the temperature is balanced within tight limits. By measuring zone temperatures at board level, programming is made easy. Even high-mass boards can be properly soldered. In standard operations, only one or two different profiles will need to be used for soldering a large variety of different boards. Additionally, a hood switch detects if the cover is open. This, in combination with two emergency switches, offers high operator security. All control electronics are fully accessible from the front of the oven for easy service access.

Now in its eighth year, the Advanced Packaging Awards program is an annual celebration of product excellence in semiconductor packaging. Premier products based on the finest examples of creative advancement in technology in 21 key areas are chosen by a distinguished panel of industry experts.