Thursday, March 26, 2009
Essemtec to Highlight Key Products and Technologies at APEX 2009
Press release, March 26, 2009
Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will feature its innovative products in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas. These machines will be offered at Special Show Pricing.
On display in Essemtec’s booth will be Pantera-XV, SP003-MLV, FLX2011LV, RO400FC, SP150, and Expert-SAFP. More information follows:
The placement system PANTERA-XV Pick+Place ideally meets the standards of a high-mix and low-volume production. The application range is large and the placement is fast and reliable. The PANTERA-XV features an ideal price/ performance ratio for small and medium enterprises. Key features include the ability to handle compnoents from 0201 to 16 mil, intelligent feeders, 1 micron X&Y encoder system. Additionally, the system is easy to program.
The SP003-MLV semiautomatic screen/stencil printer makes it easy for the operator to print precise and reproducible fine structures. The printer provides vision, is easy to use and features metal blades, tooling and vaccum hold down as standard features.
FLX2011LV Highly Flexible SMD Pick+Place is the most popular highly flexible pick+place machine for NPI. Available with Cognex vision for fine pitch ICs up to 50x50 mm. Intelligent, programmable feeders can be exchanged during operation. Available sizes for board size 700x600 mm. This system features a maximum output of 6,000 cph, a component range of 01005 to 50x50 mm and changeover with no downtime.
The Award Winning RO400FC Reflow Oven is a versatile reflow oven for medium volume soldering (lead-free or leaded solder) at 400 mm process width. Integrated microprocessor for profile control and storage. Extra high volume is for perfect soldering of complex boards. Additional oven features include 5 zone reflow oven, lead-free processing, and soldering or curing.
NEW SP150SV Standalone Semiautomatic Printer is a fine-pitch printer available with vision alignment. Its front loading makes it easy to load and unload PCBs. The printer features a through-stencil vision system plus an under stencil cleaning system. The printer can handle 23" stencils, and features front side shuttle, semiautoatic vision and integrated stencil cleaning.
Expert-SAFP SMD Pick+Place is an easy to handle semiautomatic pick+place system that provides the right tool for prototyping for the highest quality standards in the market (leading machine in Aerospace & Military prototyping in the USA). In addition to offering quick prototyping, the system provides fatigue-free production, high-quality prototypes and is computer controlled.
We look forward to meeting you in Las Vegas. Be sure to stop by Essemtec’s booth #243 for an up close look at our technologies that can help advance your company to the next level. For appointments, please contact Essemtec USA.