Friday, April 03, 2009

OSTEC Enterprise LTD. and Essemtec AG introduce key products and technology at Expo Electronica 2009

Press release, April 2, 2009

Essemtec AG, the leading manufacturer of surface mount technology production equipment, announces that it will feature together with OSTEC Enterprise LTD, the leading distributor in Russia, its innovative products in pavilion no. 3, hall12, booth 260 at the upcoming ExpoElectronica, scheduled to take place April 13. - 16.2009, in Moscow.

Essemtec AG and Ostec Enterprises LTD: will show a variety of products out of the Essemtec product line. This includes printers, high flexible high mix pick and place machines plus ovens which are perfectly suited to a mid size volume, high mix production of SMT.

The SP003 semiautomatic screen/stencil printer makes it easy for the operator to print precise and reproducible fine structures. Stencil- to substrate alignment is made an easy task by the two vision cameras. All important process parameters are machine controlled. The print format is 400x360 mm.

Production of today‘s SMT boards for prototyping or small batches requires tools to ensure the highest quality standards. The EXPERT-LINE system provides you with a complete family of pick and place machines. Over 2000 systems are in daily use worldwide. The EXPERT placement system is designed for rapid prototyping and small batch manufacturing. The integrated dispensing system and hot air soldering tool make this machine a complete production center in one single unit.

The FLX2011 pick and place is state of the art. It offers an extraordinary application range, ideal for high mix production. It features easy programming and set-up, an intelligent feeder and inventory concept and enables changeover with no downtime. The machine provides leading production technology, based on the experience on over 1'000 installations worldwide. The FLX2011 is available with Cognex vision for fine pitch IC up to 50x50 mm. Intelligent; programmable feeders can be exchanged during operation. Two board sizes for 400x300 mm or 700x600 mm are available.

In regard to component type, component density and board complexity, the soldering of state-of-the-art PCB requires professional production equipment, especially in low-volume manufacturing. Solder quality equal to that in high-volume environments must be ensured.

To meet these requirements, the RO06 reflow oven is the ideal solution. The integrated convection heater with quartz lamp support for steep ramping, an automated process flow and the feasibility of storing various profiles have made the RO06 the preferred solution in the lab and in low-volume manufacturing all over the world.

Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. The RO400FC uses full convection only to heat PCBs homogeneously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the RO400FC suitable for lead free solders as well.

Zone temperatures – three preheat and one peak – are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.
The universal mesh belt or the precise chain conveyor transports single or double-sided boards up to 400 mm (15.7“) width.

The ExpoElectronica is the largest in Russia and Eastern Europe exhibition for electronic components and technological equipment. Every year the event demonstrates new products in the electronic components sector and lets the exhibitors benefit from the steady growth and development of the exhibition.