MPL3100/3200
BGA And QFP Placer
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Manual/semiautomatic placer specialized for CSP, BGA and QFP placement. Vision with split optic enables picture overlay of board and component for easy alignment. Motorized axis for automatic placement.
- Prototyping, small batch, rework
- Image overlay alignment system
- Precies fine pitch placement
- BGA and Micro-BGA placement
SMD placement systems for prototyping and low volumes
Complex components such as BGA or QFP require special optical aids for placement, even for manual or semiautomatic placement for prototypes or small batches.
The Microplacers MPL3100 and MPL3200 are versatile placement machines for such applications. They allow highly accurate placement of modern components, such as BGA, Micro-BGA, CSP, Flip Chip and fine pitch QFP.
- Ideal for components with high lead count
- Suitable for very small components
- Easy alignment by image overlay
- High accuracy placement
- Wide zoom range for CSP to QFP
- MPL3200: placement force control
- MPL3200: Automatic pickup and placement
- Versatile substrate holder
- Ease operation
swiss made