Hochgeschwindigkeits-Jet-Dispenser 

Introduction Jetting/Dispensing

Solutions for Successfull Jetting/Dispensing Applications

Successful jetting/dispensing applications depend on:
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Scorpion

Vollautomatisches Dosiersystem der nächsten Generation

Das vollautomatischen Dosiersystem Scorpion setzt neue Massstäbe in der Dosiertechnik. Dank seiner modernsten Technologien ermöglicht es hochpräzises Dispensen mit bis zu 120‘000 Dosierpunkten pro Stunde. Einsatzgebiete sind die LED Fertigung, Elektronikfertigung, Solartechnik, Herstellung optischer und medizinischer Geräte oder auch mechanische Anwendungen.
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Jetting of SMT Adhesives

Improvements in SMT technology have diminished the need to glue components to the substrate before double sided reflow soldering. However, in recent years we have seen an increase of adhesive applications for at least the following reasons:
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Solder Paste Dispensing

Automatic application of filled materials

Reproducible dispensing of solder paste with high accuracy is a key technology in many industries. Because of its flexibility, solder paste dispensing may be used as a replacement of the printing technology in SMD prototyping. The highly sophisticated Scorpion dispensing system offers the required stability for such applications.
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CSP & BGA Underfill

Automatic application of capillary underfill materials

BGA or flip chip components are common in small size electronic devices and capillary underfillers have become very important in electronics manufacturing. Today, improved underfiller materials and the use of highly accurate dispensing systems have turned a common physical effect into a reproducible high tech process.

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Underfill for Flip Chip

High Speed Jet Dispensing To Underfill Electronic Devices

High speed jet dispensing has been established as the most effective method used to underfill electronic devices. Essemtec’s Scorpion uses the most precise Jet valve and is therefore ideally suited for accurate flip chip underfill, even in most confined spaces.
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Dam and Fill Chip Encapsulation

Essemtec’s Scorpion jetting and dispensing system can be equipped with up to four valves and is therefore ideally suited for dam & fill applications.
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Glob top and Cavity Fill

Glob top encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. The primary use is in planar substrates and cavity packages. Essemtec’s high speed high accuracy jet valve will achieve the highest productivity. For lower volume applications, a screw valve or time pressure valve may also be suitable.
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Die Bonding Paste

Void free die attach dispensing is very important for all electronic devices. High process stability and a big process window is achieved with special dispense patterns, often not achievable with needle dispensing. Essemtec’s eDIS software has many common scalable patterns saved in its library but you can also easily create your own pattern.

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Lid Seal

Lid sealing is one of the final steps in a variety of cavity style semiconductor packages. A controlled amount of adhesive is dispensed, the lid placed and cured. Alternatively, many solder pastes can be used for hermetic sealing with soldered lids.
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Thermo Compression Bonding

Non conductive paste is used instead of underfill for gold stud bumped flip chip interconnections using a thermo compression bonding process. The adhesive is jetted before die placement and is cured from the heat of the thermo compression. Essemtec’s eDIS software enables process engineers to easily design DOEs to create the most reliable dispensing pattern.
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Thermal Grease

As power densities in packages continue to increase, heat transfer is optimized using thermal compounds. Essemtec is able to dispense or jet most of these novel materials at high speeds, with high positioning accuracy and with excellent volume control. Moreover, Essemtec’s eDIS software allows unlimited creativity for pattern programming.
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2.5/3D Packaging

With ever shrinking geometries, 2.5D and 3D packages gain popularity in microelectronics. Through-silicon vias (TSV) are used with silicon interposers, while other packages use Package-on-Package (PoP) or stacked die constructions. All these applications require the application of underfill, conductive adhesives and encapsulates at multiple levels. Hence Essemtec’s jetting solutions are highly beneficial and enable the jetting into highly confined areas.
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CDS-JET-DS30/32

Jet-Dosierventil

Feinst-Dosierventil für niedrig- bis hochviskose Flüssigkeiten. Auch geeignet für chemische und pharmazeutische Lösungen, Sekundenkleber oder Kleber mit Füllstoffen. Dosiervolumen 2 bis 10'000 nl pro Hub sind programmierbar. Das Ventil schiesst Tropfen über Distanzen bis 100 mm.
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CDS-DTP

Zeit-Druck-Ventil

Ein genau kontrollierter Druck/Zeit-Puls wird direkt auf die Kartusche appliziert. Das Ventil benötigt deshalb weder Dichtungen noch bewegliche Teile, wodurch es sehr robust und zuverlässig arbeitet. Es hat einen sehr grossen Anwendungsbereich.
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CDS-DSV

Archimedisches Schraubenventil

Flüssigkeits-Dosierung mittels dem Prinzip der Archimedes-Schraube. Dosiert auch Medien mit weichen Füllstoffen, z.B. Lotpaste. Sehr präzises und schnelles Ventil.
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CDS-HCV

Heiz&Kühl-Dosierventil

Das Heiz&Kühl-Ventil kontrolliert die Dosiertemperatur exakt, unabhängig davon ob es in der Umgebung 10° heisser oder kühler ist. Das integrierte Peltier-Element reagiert entsprechend und kühlt oder heizt um die Temperatur konstant zu halten.
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CDS-PFV

Piezo-Flow Ventil

Das CDS-PFV (PFV=Piezo Flow Ventil) wurde speziell für gefüllte Flüssigkeiten entwickelt. Durch die besondere Ventil- Verschlusstechnik lassen sich mit diesem Ventil auch Medien mit weichen Partikeln genau dosieren, wie zum Beispiel Lotpasten.
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