RO-06-PLUS
Batch Reflow Oven
Prototyping oven with motorized drawer for automatic processing. Combi-heater system convection/infrared ensures homogenous temperature distribution and enables steep ramps. Integrated microprocessor for profile control and storage.
- Compact design
- Automatic processing
- Process area 400x300 mm
- Microprocessor controlled
Drawer-type batch reflow oven
In regard to component type, component density and board complexity, the soldering of state-of-the-art PCB requires professional production equipment, especially in low-volume manufacturing. Solder quality equal to that in high-volume environments must be ensured.To meet these requirements, the RO06 reflow oven is the ideal solution. The integrated convection heater with quartz lamp support for steep ramping, an automated process flow and the feasibility of storing various profiles have made the RO06 the preferred solution in the lab and in low-volume manufacturing all over the world.
- Homogeneous convection heater
- Quartz lamp supports quick heating
- Lead-free or standard soldering profiles
- Motor-driven drawer for automated process flow
- Microprocessor control with large memory
- Large viewing window for process monitoring
- Unique pause function for process evaluation
- External sensors for in-board measurements
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| | Integrated microprocessor control permits the programming of a basic temperature (T1), the desired pre-heat temperature and time (T2), as well as the required soldering temperature and time (T3). After cooling down to T4, the drawer automatically moves out of the heat chamber. |
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| | The large viewing window enables visual monitoring of the process running inside the sealed heat chamber. Using the unique pause function, a given solder profile can be extended manually. This ensures that a new product is correctly soldered in the first pass. |
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| | Two external temperature sensors allow the measuring of profiles directly in the circuit board. The integrated LCD panel directly indicates the measured temperature values. |
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| | The Windows-compatible RO-SOFT software records the measured profiles as well as the chamber temperature. The temperature curves can be stored and graphically superimposed for process control. |
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A Flex2 service package is available for this product. Click here for more information. | |
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Clean
Fumes from the heat chamber can be exhausted directly by a fume extraction system.
Automatic processing
The motor-driven drawer automatically moves back and forth between heat chamber and forced air cooling zone.
Temperature regulation
The integrated microprocessor control sets exact values for temperature and time and provides a comprehensive program library. In addition, it can store custom programs as well.
Soldering or curing
The profile library of the RO06-Plus includes programs for standard and lead free soldering as well as for curing applications.
Quality assurance
The temperature profiles measured can be graphically displayed on a PC, connecting via RS-232 interface. (RO-SOFT).
| Model | RO06-Plus |
| Max. PCB size | 400x300 mm |
| Max. PCBheight | 30 mm |
| Control | Microprocessor |
swiss made