RO400FC

Full Convection Reflow Oven

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RO400FC Full Convection Reflow OvenVersatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards.

  • 5 zone reflow oven
  • 400 mm process width
  • Soldering or curing
  • Lead-free processing


Hot air full convection reflow oven

Soldering of complex SMD boards and new package technologies requires a well-controlled soldering process. The RO400FC uses full convection only to heat PCBs homogeniously. The convection technology uses vertical laminar flow, which offers an efficient heat transfer with the lowest delta T values. This technology makes the RO400FC suitable for lead free solders as well.
Zone temperatures – three preheat and one peak – are fully programmable, as is the closed-loop-controlled conveyor speed. Zone temperatures are measured within the airflow at the board height to guarantee highly reproducible soldering conditions.
The universal mesh belt or the precise chain conveyor transports single or double-sided boards up to 400 mm (15.7“) width.

 

  • Full convection heating for even temperature distribution
  • For solder pastes with or without lead
  • High air volume for low thermal stress
  • Efficient heat transfer
  • Mesh belt or chain conveyor
  • Closed loop controlled conveyor drive system
  • Integrated microprocessor control with LCD
  • Built-in overheat security switches 

 

 

 

The RO400FC is equipped with 5 special oven steel hot air convection modules (four top / one bottom within the reflow zone). Each module contains a high volume blower and unique airflow construction for ideal heat transfer.

 

 

The integrated microprocessor control with LCD display provides an easy-to-use operator interface and storage capacity of up to 28 profiles. The memory provides program proposals and enough space for own profiles.

 

 

With RO-CONTROL new soldering tasks can be simulated and it offers unlimited storage space for programs. Measured temperature profiles can be superimposed graphically.

 

A Flex2 service package is available for this product. Click here for more information.

 

 

  • Remote support software
  • 24 hour hotline
  • Local support
  • Local spare parts
  • Financing solutions
  • Investment protection
  • Process training
  • MyEssemtec Intranet access
  • Worldwide competence centers
  • Customer specific application solutions

 

 

Uniform heating

The convection technology applies the same temperature everywhere on the board independent of component size or color, making programming as easy as possible.

Efficient cooling

In the cooling zone, two highly efficient blowers cool down the PCB quickly.

Transport system choices

Depending on the application a mesh belt, chain or even a double chain conveyor system is used for substrate transport. The transport with adjustment of the chain conveyor is motorized.

Easy integration

SMEMA connectors provide the ability to link the RO400FC with any other compatible equipment.

Process control

With the optional flying thermocouples, temperatures can be recorded directly on the board and displayed on the machine’s LCD display.

 

Model

 RO400FC

 RO400FC-C

Description

 Mesh belt conveyor

 Chain conveyor

Heating+cooling zones

 4+1

 

PCB width

 400 mm

 

 

 

Add-on values
 

 

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