High Speed Jetting
Introduction
Introduction Jetting/Dispensing
Solutions for Successfull Jetting/Dispensing Applications
Successful jetting/dispensing applications depend on:[ More information ] [ Add to clipboard ]
Key features
- the choice of a proper valves for a given fluid
- capable software for recipe creation and valve control
- and lastly on a stable xyz positioning gantry
Machine Details
Scorpion
Fully Automatic High Speed Jetter
The automatic dispensing machine Scorpion sets new standards in the dispensing technology. Thanks to its newest technologies the Scorpion can dispense up to 120’000 dots per hour. Fields of application are any production such as LED electronics, solar cells, optical and medical devices or mechanical applications.[ More information ] [ Add to clipboard ]
Key features
- Easily adaptable for your application
- Up to 4 dispensing valves
- Free choice of dispensing valve
- Inline or standalone
Applications SMT
Jetting of SMT Adhesives
Improvements in SMT technology have diminished the need to glue components to the substrate before double sided reflow soldering. However, in recent years we have seen an increase of adhesive applications for at least the following reasons:[ More information ] [ Add to clipboard ]
Key features
- Gluing of components to increase their resistance to vibration and shocks such as in LED lamps, hand held devices, automotive circuits
- Gluing of components before double sided soldering for heavy duty power electronics
Solder Paste Dispensing
Automatic application of filled materials
Reproducible dispensing of solder paste with high accuracy is a key technology in many industries. Because of its flexibility, solder paste dispensing may be used as a replacement of the printing technology in SMD prototyping. The highly sophisticated Scorpion dispensing system offers the required stability for such applications.[ More information ] [ Add to clipboard ]
Key features
- Fully automatic dispensing system for paste applications such as SMD prototyping, pin-in paste or hybrid circuits
- Add-on dispensing of solder paste instead of using expensive step stencils
- Reproducible accurate dispensing of smallest volumes
- Dispensing of filled media with Archimedean screw valve or piezo flow valve
CSP & BGA Underfill
Automatic application of capillary underfill materials
BGA or flip chip components are common in small size electronic devices and capillary underfillers have become very important in electronics manufacturing. Today, improved underfiller materials and the use of highly accurate dispensing systems have turned a common physical effect into a reproducible high tech process.
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Key features
- Underfill ball grid arrays and chip scale packages on bare boards
- Fastest jet valve on the market
- Optional material heating and valve heating
Applications Semiconductor Packaging
Underfill for Flip Chip
High Speed Jet Dispensing To Underfill Electronic Devices
High speed jet dispensing has been established as the most effective method used to underfill electronic devices. Essemtec’s Scorpion uses the most precise Jet valve and is therefore ideally suited for accurate flip chip underfill, even in most confined spaces.[ More information ] [ Add to clipboard ]
Key features
- Automatic dispensing system for underfiller materials used for BGA, Micro-BGA or Flip-Chip
- Fast and precise by XY-drive system with high resolution linear scales
- Non-contact application
- Integrated laser scanner for automatic height calibration
Dam and Fill Chip Encapsulation
Essemtec’s Scorpion jetting and dispensing system can be equipped with up to four valves and is therefore ideally suited for dam & fill applications.[ More information ] [ Add to clipboard ]
Key features
- Up to 4 valves to perfectly suit dam & fill applications
- Fast, simple & intuitive programming thanks to eDis
- Jetting or dispensing is possible
Glob top and Cavity Fill
Glob top encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. The primary use is in planar substrates and cavity packages. Essemtec’s high speed high accuracy jet valve will achieve the highest productivity. For lower volume applications, a screw valve or time pressure valve may also be suitable.[ More information ] [ Add to clipboard ]
Key features
- Ultra precise jetting process to protect chip and bonding wires from environmental forces and moisture
- Jetting or dispensing is possible
- Increase of reliability of the underfilled die
- Important alternative to molding
Die Bonding Paste
Void free die attach dispensing is very important for all electronic devices. High process stability and a big process window is achieved with special dispense patterns, often not achievable with needle dispensing. Essemtec’s eDIS software has many common scalable patterns saved in its library but you can also easily create your own pattern.
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Key features
- Precise high speed jetting for highest process stability
- Fast, simple & intuitive programming thanks to eDis
- Large fluid database with “Best Known” settings
- Well suited for all die attach applications
Lid Seal
Lid sealing is one of the final steps in a variety of cavity style semiconductor packages. A controlled amount of adhesive is dispensed, the lid placed and cured. Alternatively, many solder pastes can be used for hermetic sealing with soldered lids.[ More information ] [ Add to clipboard ]
Key features
- Free choice of dispensing valve
- Fast, simple & intuitive programming thanks to eDis
- Fast and precise by XYZ-drive system
Thermo Compression Bonding
Non conductive paste is used instead of underfill for gold stud bumped flip chip interconnections using a thermo compression bonding process. The adhesive is jetted before die placement and is cured from the heat of the thermo compression. Essemtec’s eDIS software enables process engineers to easily design DOEs to create the most reliable dispensing pattern.[ More information ] [ Add to clipboard ]
Key features
- Integrated laser scanner for automatic height calibration
- Precise fluid amounts
- Fast, simple & intuitive programming thanks to eDis
Thermal Grease
As power densities in packages continue to increase, heat transfer is optimized using thermal compounds. Essemtec is able to dispense or jet most of these novel materials at high speeds, with high positioning accuracy and with excellent volume control. Moreover, Essemtec’s eDIS software allows unlimited creativity for pattern programming.[ More information ] [ Add to clipboard ]
Key features
- High speed jetting or dispensing is possible
- Up to 4 valves to best suit your application and fluids
- Fast, simple & intuitive programming thanks to eDis
2.5/3D Packaging
With ever shrinking geometries, 2.5D and 3D packages gain popularity in microelectronics. Through-silicon vias (TSV) are used with silicon interposers, while other packages use Package-on-Package (PoP) or stacked die constructions. All these applications require the application of underfill, conductive adhesives and encapsulates at multiple levels. Hence Essemtec’s jetting solutions are highly beneficial and enable the jetting into highly confined areas.[ More information ] [ Add to clipboard ]
Key features
- High speed jetting into highly confined areas
- Fast and precise by XYZ-drive system
- More functionality fits into a small space
- Underfilling multiple die layers in the stack
Dispensing Valves
CDS-JET-DS30/32
Jet Dispensing Valve
Micro dispensing valve for low to high viscous liquids. Also suitable for chemical and pharmaceutical agents, glue or adhesives with fillers. Dispensing volumes from 2 to 10'000 nl per stroke are programmable. The valve shoots drops over a distance of up to 100 mm.[ More information ] [ Add to clipboard ]
Key features
- Non-contact metering
- Large viscosity range
- Easy cleaning
- Special media dispensing
CDS-DTP
Time/Pressure Valve
A controlled pressure pulse with a controlled duration is applied directly to the cartridge. No moving valve parts, therefore very robust and reliable valve. The time/pressure valve has a very wide application range.[ More information ] [ Add to clipboard ]
Key features
- Simple and robust
- No sealings
- No motion parts
- Wide application range
CDS-DSV
Archimedean Screw Valve
Uses an archimedean screw for fluid conveying. Can dispense fluids with weak fillers, such as solder paste. Precise and fast valve.[ More information ] [ Add to clipboard ]
Key features
- Precise volume control
- Reproducible results
- Fluids with fillers
- Fast dispensing
CDS-HCV
Heat & Cool Valve
The Heat & Cool Valve controls the dispensing temperature exactly, independent if the ambient temperature is 10 degrees hotter or cooler. The built-in Peltier element can do both, heat or cool.[ More information ] [ Add to clipboard ]
Key features
- Independent of ambient conditions
- Regulation range +/- 10°
- Air or liquid energy dissipation
CDS-PFV
Piezo Flow Valve
The CDS-PFV (PFV=Piezo Flow Valve) has been developed for "filled" liquids. The special valve sealing technique allows the dispensing of media with weak media such as solder paste.[ More information ] [ Add to clipboard ]
Key features
- Special valve for filled liquids
- Solder paste dispensing
- Conductive glue dispensing
- Integrated valve heating
swiss made