We are thrilled to invite you to SMTconnect, Booth 4.209, June 11 - 13 in Nuremberg, Germany. Discover Essemtec's Solutions with All-in-One combined dispensing & pick and place processes, and Integrated Inspection System.
We focus on proven applications in different areas of electronics production and SMTconnect Premieres:
• Chip Underfill
• Fully Integrated PCB Inspection
• BGA Dispensing and Reballing
Furthermore, we will showcase Essemtec`s enhanced speed performance:
• High-Speed Solder Paste Jetting Solution
We will run attention grabbing demos at dedicated stations for each of the above solution.
Witness live the power of our PUMA for All-in-One and High-Speed Jetting, TARANTULA for chip underfill, as well as High-Mix Low-Volume production line with FOX & SPIDER and Smart Material Management.
Our engineers and sales team will share best tips for the hottest SMT topics on the market to help you increase the flexibility and productivity of your production line and optimize your manufacturing costs.
Order your tickets online or contact Essemtec Marketing.
Personal Invitation by Franck Genonceau, Director EMEA
